During the design phase, we conducted an in-depth investigation of the chassis heat dissipation requirements and installation standards, combined with fluid mechanics simulation to optimize the hole density and arrangement, such as encrypting the holes for high-heat graphics card areas. In the production process, a multi-station continuous stamping die is used, combined with a servo press to achieve integrated punching, blanking, and trimming to ensure that the mesh surface is free of burrs and deformation. The surface can be sprayed and anodized to enhance the anti-corrosion and anti-rust properties, and adapt to humid and dusty environments.

The actual application covers the fields of consumer electronics and industrial control. In the computer case, it provides ventilation channels for the CPU and GPU heat dissipation modules to help the game console run stably; in the industrial control cabinet, it protects servers, PLCs and other equipment, and ensures low-temperature and clean operation of equipment in high-temperature workshops, data centers and other scenarios. With the characteristics of "precise heat dissipation, reliable protection, and flexible adaptation", it has become a core component of chassis hardware integration, promoting the two-way improvement of electronic equipment in performance and stability, and building a solid heat dissipation protection barrier for efficient operation of equipment.