Universal aluminum strip fin heat sink, made of 6063 aluminum alloy, formed by precision extrusion process. The strip structure with parallel dense fins effectively increases the heat dissipation surface area, which can quickly absorb and dissipate the heat generated by electronic components. It has strong adaptability and is suitable for narrow and long heat-generating components such as computer memory, M.2 solid-state hard disk, industrial control board, etc. Through natural convection or with auxiliary fans, it can easily meet the heat dissipation needs of various devices and ensure stable operation of the equipment.
Core advantages | Technical highlights | Application value |
High adaptability | Length covers 50 - 200mm, width 15 - 30mm, thickness 2 - 5mm, multiple specifications are optional; support customized hole positions and sizes | Perfectly adapt to different devices such as memory, SSD, industrial control board, etc., easy to install |
Efficient heat dissipation | Fin density reaches 30 - 40 pieces/cm, and the heat dissipation area is increased to 2 times that of ordinary radiators; 6063 aluminum alloy thermal conductivity coefficient 180 - 230W/(m・K) | Quickly suppress the heat of electronic components to avoid performance degradation due to overheating |
Durable and reliable | The surface is anodized, the oxide film thickness reaches 20μm, and the salt spray test is more than 1000 hours without corrosion; the tensile strength reaches 200MPa | Adapt to complex environments such as high temperature, humidity, dust, etc., with a service life of up to 8 years |
Energy-saving and quiet | Pure passive heat dissipation design, 0 noise operation; no additional power supply is required, in line with the concept of green environmental protection | Suitable for silent scenes such as libraries and home theaters to reduce equipment energy consumption |
Process: High-precision extrusion molding process is adopted to ensure the precise size and uniform spacing of the fins; the surface is anodized to form a dense oxide film, which enhances the anti-oxidation and anti-corrosion capabilities and gives the product a beautiful metallic luster; the edges are polished to prevent scratches on the equipment and human body during installation.
Item | index | Description |
Material | 6063 aluminum alloy | Taking into account both thermal conductivity and economy |
Dimensions | Length 50 - 200mmWidth 15 - 30mmThickness 2 - 5mm | A variety of standard sizes are available, and customization is supported |
Fin thickness | 0.2 - 0.3mm | Optimize heat dissipation efficiency and structural strength |
Fin density | 30 - 40 片 /cm | Increase heat dissipation area |
Heat dissipation area | 3000 - 8000cm² | Adapt to different heat load requirements |
Operating temperature | -40℃ - 180℃ | Adapt to extreme environmental conditions |
Installation method | Double-sided adhesive / screw fixing | Flexibly adapt to various types of equipment |
Application scenarios
Computer hardware cooling: Cooling for M.2 solid-state drives and high-frequency memory modules, improving data reading and writing speeds and extending hardware life; it can also be used for graphics card power supply modules to ensure stable operation of graphics cards under high loads such as gaming and rendering.
Industrial control field: In industrial computer motherboards and automation control cabinets, it cools chips and power modules on the boards to adapt to harsh industrial environments such as high temperature and vibration, ensuring continuous and stable operation of the equipment.
Communication equipment: Cooling for small heating components in 5G base stations and switches to ensure stable signal transmission and improve equipment reliability and service life.
Smart home devices: Used for smart gateways, smart cameras and other devices, zero-noise operation does not interfere with the home environment, while ensuring stable equipment performance and meeting the cooling needs of home smart devices.