The pure copper CPU heatsink is a heat dissipation tool specially designed for high-performance CPUs, focusing on solving the heat dissipation problem during high-load operation. With high-purity oxygen-free copper as the core material, it takes advantage of the excellent thermal conductivity of copper, and is matched with dense fins and high-efficiency fans (or adapted to passive heat dissipation scenarios). The heat pipe (if any), base and fins are mostly made of pure copper, and are formed in one piece through vacuum welding and other processes, which quickly absorbs CPU heat and conducts it to the fins. Whether the computer is running large-scale games, performing professional rendering, or the server is working at high load 24 hours a day, it can efficiently export heat, maintain a reasonable CPU temperature, avoid performance reduction and system failure, and build a solid "cooling defense line" for stable hardware operation.
2. Product Features
Core advantages | Technical highlights | Application value |
Extreme thermal conductivity | Using 99.99% high-purity oxygen-free copper, the thermal conductivity exceeds 400W/(m・K), and the heat conduction efficiency is increased by 30%+ | Instantly absorbs high CPU heat, adapts to high-end CPUs such as i9 and Ryzen 9, and ensures full performance |
Precise heat dissipation structure | The fins are CNC milled/forged, and the thickness is precisely controlled at 0.2-0.3mm, and the fin density reaches 40-50 pieces/cm² | Greatly increases the heat dissipation area, accelerates heat and air exchange, and enhances the heat dissipation effect |
Long-term stability | The surface of the pure copper parts is treated with an anti-oxidation coating (such as nickel plating), and the salt spray test exceeds 2000 hours to prevent copper rust from affecting thermal conductivity | Long-term stable operation, adapts to long-term working scenarios such as servers and industrial computers, and reduces maintenance costs |
Multi-scenario adaptation | Supports Intel LGA full series, AMD AM full platform buckles, compatible with active air cooling, passive cooling (pure copper fins natural cooling) mode | Meets the heat dissipation needs of different devices such as game consoles, workstations, and silent industrial computers, and is flexible to install |
III. Product Details
(I) Materials and Process
1. Material: The main body is made of 99.99% high-purity oxygen-free copper, which has low impurities and high thermal conductivity; some models of heat pipes (if configured) are pure copper vacuum cavities filled with high-efficiency phase change working fluids to enhance heat transfer.
2. Process: Vacuum brazing technology is used to ensure seamless connection of pure copper parts to avoid thermal resistance; the fins are formed by precision forging/milling to ensure uniform thickness and precise spacing, and nickel plating/anodizing treatment is used to improve oxidation resistance and aesthetics.
(II) Technical Parameters
Item | Specifications | Description |
Material purity | 99.99% oxygen-free copper | Guarantees the ultimate thermal conductivity |
Fin thickness | 0.2 - 0.3mm | Balances heat dissipation area and wind resistance |
Base flatness | ≤0.01mm | Closely fits the CPU to reduce contact thermal resistance |
Compatible platform | Intel LGA1700/1200/2066、AMD AM5/AM4 | Covering mainstream CPU interfaces |
Cooling mode | Active air cooling / passive cooling | Adapts to different noise and performance requirements |
(III) Application scenarios
1. High-end gaming consoles: Cooling for flagship CPUs such as i9 and Ryzen 9, coping with high loads of 3A games, ensuring stable frame rates, and preventing freezes and dropped frames due to overheating.
2. Professional workstations: In scenarios such as video rendering and 3D modeling, continuously suppress CPU high temperatures, accelerate computing processes, and improve creative efficiency.
3. Servers/industrial computers: 7×24 hours of stable heat dissipation, adapting to long-term operation of data centers and industrial control equipment, and ensuring system reliability.
4. Silent host: With passive heat dissipation (pure copper fins for natural heat dissipation) or low-speed fans, it meets the silent needs of audio-visual entertainment and office scenes.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
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