The multi-module combined aluminum fin heat sink is designed for multi-heat source equipment. It adopts a modular splicing architecture and is composed of multiple independent aluminum fin modules and a metal heat conduction frame. Each module can accurately correspond to different heat-generating components such as the CPU, GPU, and power module. The metal frame quickly conducts heat and cooperates with a large air volume fan to achieve multi-area synchronous and efficient heat dissipation. The flexible combination design is suitable for complex heat dissipation scenarios such as servers and high-end workstations, providing reliable protection for the stable operation of the equipment.
2. Product Features
Core advantages | Technical highlights | Application value |
Flexible modular design | The size of a single module is adjustable, supporting free splicing of 2-8 modules; magnetic/snap-on quick connection structure | Adapt to motherboards and chassis of different sizes to meet the customized cooling needs of diversified equipment such as servers and workstations |
Efficient collaborative heat dissipation | High thermal conductivity copper connectors are used between modules, and the heat conduction efficiency is increased by 50%; the fin density reaches 40 pieces/cm, and the total heat dissipation area exceeds 30000cm² | Synchronize the temperature of multiple heat sources to ensure stable operation of multi-core hardware under high load |
Intelligent dynamic adjustment | Equipped with multiple sets of PWM smart fans, supporting independent temperature control and speed regulation; the fan speed range is 600-2000RPM, and the noise is as low as 22dB (A) | Adjust wind speed on demand, taking into account quietness and efficient heat dissipation, and adapt to different usage scenarios |
Durable and corrosion-resistant | The fins are made of 6063-T5 aluminum alloy, the surface anodized film is 25μm thick, and the salt spray test is more than 1800 hours without corrosion | Adapt to complex environments such as high temperature, humidity, and dust, with a service life of up to 10 years |
Convenient maintenance | The modules can be disassembled and replaced independently; tool-free installation design, disassembly and assembly can be completed within 5 minutes | Reduce maintenance difficulty and cost, and reduce equipment downtime |
III. Product Details
(I) Material and Technology
Fin material: 6063-T5 aluminum alloy is selected, which has a high thermal conductivity of 180-230W/(m・K) and excellent mechanical strength. It is formed by precision stamping process, and the thickness of the fin is 0.25mm, ensuring heat dissipation efficiency and structural stability.
Connection parts: The connectors between modules are made of high-purity oxygen-free copper, and the surface is nickel-plated to prevent oxidation. It is seamlessly combined with the fin module through ultrasonic welding technology to minimize thermal resistance.
Surface treatment: All aluminum parts are anodized to form a dense oxide film, which not only improves corrosion resistance, but also gives the product a unified metallic appearance.
(II) Technical parameters
Project | Specifications | Description |
Module material | 6063-T5 aluminum alloy | High strength, high thermal conductivity |
Module size | Standard module: 120×80×30mm (customizable) | Adapt to different space requirements |
Fin density | 40 pieces/cm | Increase heat dissipation area |
Heat dissipation area | Single module 5000cm², maximum 30000cm²+ after combination | Meet the heat dissipation of multiple heat sources |
Fan specification | 120mm PWM fan, supports 1 - 4 groups of installation | Build a strong air duct |
Air volume | Single fan 85CFM, multi-fan linkage adjustable | Adjust wind speed on demand |
Noise value | 22 - 45dB(A) | Intelligent speed control to control noise |
Compatible platform | Supports Intel, AMD full range of CPUs and mainstream GPUs, power modules | Cover a wide range of hardware |
(III) Application scenarios
Data center servers: For high-density server clusters, multiple modules accurately cover multiple heating areas such as CPU, memory, and hard disk, ensuring 7×24 hours of stable operation and reducing operation and maintenance costs.
Professional graphics workstations: Cooling workstations equipped with multi-core CPUs and high-performance graphics cards, effectively suppressing hardware temperature and improving work efficiency in high-load tasks such as 3D modeling and film and television post-rendering.
Industrial automation equipment: In harsh industrial environments such as high temperature and dust, the modular design facilitates the rapid replacement of damaged parts to ensure the continuous and stable operation of industrial computers, control cabinets and other equipment.
High-end game consoles: Meet the needs of game consoles that generate heat in multiple hardware, such as suppressing the temperature of the CPU, graphics card, and motherboard chipset at the same time, helping players enjoy high-quality and high-frame rate gaming experience.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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