The multi-heat pipe dense fin combined CPU cooler is designed to meet the stringent heat dissipation requirements of flagship CPUs under high load. It is equipped with 6 to 8 high-purity oxygen-free copper heat pipes with a diameter of 6mm or 8mm. With the efficient heat transfer principle of the internal working fluid gas-liquid phase change, the high heat generated by the CPU can be quickly transferred to the cooling module in an instant. With dense aluminum or copper fins with a density of up to 45-55 pieces/cm, through precision stamping and wavy structure design, the heat dissipation surface area is greatly expanded to form a powerful heat exchange system.
2. Product Features
Core advantages | Technical highlights | Application value |
Extreme thermal conductivity | Equipped with 6-8 pure copper heat pipes, the heat conduction speed is 80% higher than that of ordinary radiators; the inner wall of the heat pipe adopts high-performance powder sintering liquid absorption core to enhance the heat transfer efficiency | Easily suppress the high heat of top CPUs such as i9 and Ryzen 9 when fully loaded, ensuring full output of hardware performance |
Large heat dissipation area | The fin density is as high as 45-55 pieces/cm, and the heat dissipation area of a single set of fins exceeds 20000cm²; the fins and heat pipes adopt vacuum brazing technology, and the thermal resistance is reduced by 50% | Greatly improve the heat dissipation speed, ensure stable operation of the CPU under long-term high load, and extend the service life |
Intelligent silent control | Equipped with dual 12cm PWM intelligent speed-adjustable fans, the speed range is 500-2200RPM, and dynamic temperature control is supported; FDB fluid dynamic bearings and 7-blade sickle fan blade design are adopted, and the operating noise is as low as 20dB (A) | Almost silent in daily use, automatically enhance heat dissipation under high load, taking into account both quietness and efficiency |
Full platform compatibility | Support Intel LGA1700/1200/115X, AMD AM5/AM4 and other mainstream CPU platforms; equipped with tool-free quick release buckles, suitable for various tower, ITX Chassis | Covering more than 98% of desktop computers on the market, easy to install, and easy for novices to get started |
Long-lasting and durable quality | The heat pipe adopts vacuum sealing welding technology to eliminate the risk of leakage; the surface of the fin is anodized (aluminum) or nickel-plated (copper), and the salt spray test is over 1500 hours without corrosion | Provide a 5-year long warranty, adapt to complex usage environments, and greatly reduce maintenance costs |
III. Product Details
(I) Material and Process
Heat pipe: oxygen-free copper heat pipe with a purity of 99.99% is selected, with a diameter of 6mm or 8mm, filled with high-efficiency thermal conductive medium, and a powder sintered liquid wick; precise bending is achieved through CNC bending technology to ensure close fit and efficient thermal conductivity with the CPU and fins.
Fins: Aluminum fins are made of 7075 aviation-grade aluminum alloy, formed by high-precision stamping, and anodized on the surface to improve oxidation resistance; copper fins are made of T2 copper, which is precision milled by CNC to ensure uniform fin thickness and precise spacing, further enhancing heat dissipation performance.
Welding process: Vacuum brazing technology is used to achieve seamless connection between heat pipes and fins, ensuring zero heat conduction loss and improving overall heat dissipation efficiency.
(II) Technical Parameters
Item | Specifications | Description |
Heat pipe specifications | 6mm×6 pieces / 8mm×8 pieces | Different configurations meet differentiated cooling needs |
Fin material | 7075 aluminum alloy / T2 copper | Can be selected as needed |
Fin thickness | 0.2 - 0.25mm | Optimize cooling efficiency and wind resistance balance |
Fin density | 45 - 55 片 /cm | Greatly increase cooling area |
Fin size | 135×135×60mm（customizable） | Provide sufficient cooling space |
Fan specifications | 120mm×120mm×25mm×2 (dual fans) | Build a strong air duct |
Air volume | 80 - 110CFM | Ensure efficient air circulation |
Noise value | 20 - 40dB(A) | Intelligent speed control to control noise |
Compatible platforms | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Cover mainstream CPU interfaces |
(III) Application scenarios
High-end gaming consoles: Cooling for flagship CPUs such as i9-14900K and Ryzen 9 9950X, ensuring that the game runs stably at high frame rates and high image quality throughout the entire process, bringing an immersive gaming experience.
Professional workstations: In scenarios such as film and television post-rendering, 3D animation production, and scientific data analysis, it continuously suppresses CPU high temperatures, accelerates task processing speed, and significantly improves work efficiency.
Data center servers: Meet the cooling needs of high-density server clusters, ensure 7×24 hours of uninterrupted and stable operation, and reduce the failure rate and operation and maintenance costs of data center equipment.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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