High-density fin heat sink is a highly efficient heat dissipation device specially developed to solve the problem of high heat generation in electronic equipment. It is made of aluminum alloy or copper alloy as the main material, and the metal material is made into a tightly arranged and well-structured fin-shaped structure through precision stamping, milling or forging processes. Compared with traditional heat sinks, its fin density is greatly improved, up to 40-50 fins per centimeter, which greatly increases the heat dissipation surface area and can quickly absorb the large amount of heat generated by electronic components such as CPU, GPU, power module, etc. during operation.
Core advantages | Technical highlights | Application value |
Superior heat dissipation performance | The fin density is 40-50 pieces/cm, and the heat dissipation area is increased to 3 times that of ordinary radiators; the thermal conductivity of aluminum alloy is 180-230W/(m・K), and the copper alloy is as high as 400W/(m・K) | Easily suppress the heat of core components such as CPU and GPU to ensure stable operation of game consoles and servers under high load |
Silent and zero interference | Pure passive heat dissipation design, fanless operation, and 0dB operating noise | Suitable for noise-sensitive environments such as libraries, recording studios, and home theaters |
Durable and corrosion-resistant | The fin surface is anodized (aluminum alloy) or nickel-plated (copper alloy), and the salt spray test is more than 1000 hours without corrosion | Adapt to complex environments such as high temperature, humidity, and dust, with a service life of up to 8-10 years |
Flexible adaptability | Supports mainstream platforms such as Intel LGA, AMD AM; provides a variety of sizes and specifications to adapt to different chassis spaces | Widely used in desktops, industrial computers, embedded devices, etc., easy to install |
Energy saving and low consumption | No need for electric drive, zero energy consumption, in line with the concept of green environmental protection | Reduce the overall power consumption of the equipment, reduce operating costs, and adapt to energy-sensitive scenarios |
III. Product Details
(I) Material and Process
.Material Selection:
Aluminum Alloy: 6063 or 7075 aluminum alloy is used. 6063 aluminum alloy has high cost performance and good thermal conductivity, which is suitable for conventional heat dissipation scenarios; 7075 aviation-grade aluminum alloy has high strength and excellent thermal conductivity, which meets the needs of high-end equipment.
Copper Alloy: T2 copper is used, with a purity of up to 99.9% and extremely high thermal conductivity, specially designed for high-heat components such as CPU and GPU.
.Processing Technology: High-precision stamping and CNC milling technology are used to ensure accurate fin size and uniform spacing; reflow soldering or vacuum brazing process is used to achieve seamless connection between fins and base to reduce thermal resistance; surface treatment uses anodizing (aluminum alloy) or nickel plating (copper alloy) to enhance anti-oxidation and anti-corrosion capabilities.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
CN
