The heat pipe fin combination is designed to solve the heat dissipation problem when the CPU is running at high load. It uses high-purity oxygen-free copper heat pipes as the core heat-conducting components, and is matched with precision-machined aluminum or copper fins to form an efficient heat dissipation system. The heat pipe uses the gas-liquid phase change principle of the internal working fluid to transfer the heat generated by the CPU to the fins at an extremely fast speed; the fins are shaped in special shapes such as wavy and zigzag shapes to greatly increase the heat dissipation area, and with a large air volume silent fan, it forces the air to flow quickly and accelerates the heat dissipation.
Core advantages | Technical highlights | Application value |
Superior thermal conductivity | Equipped with 4-6 6mm or 8mm diameter pure copper heat pipes, the heat conduction efficiency is increased by 60%; the inner wall powder sintering liquid absorption core design enhances the heat transfer capability | Quickly absorb and transfer high CPU heat, easily suppress the full-load power consumption of flagship CPUs such as i9 and Ryzen 9 |
Efficient heat dissipation structure | The fin density reaches 30-45 pieces/cm, and the heat dissipation area exceeds 15000cm²; the fins and heat pipes adopt reflow soldering or vacuum brazing process, and the thermal resistance is reduced by 40% | Greatly improve the heat dissipation speed, ensure stable operation of the CPU under high load, and extend the life of the hardware |
Intelligent and silent operation | Equipped with PWM intelligent speed control fan, the speed range is 600-2000RPM, and the motherboard temperature control is supported; the hydraulic bearing and sickle-shaped fan blade design, the operating noise is as low as 22dB (A) | Quiet and silent daily office work, automatic speed-up during game rendering, balance between silence and heat dissipation |
Wide compatibility | Support Intel LGA1700/1200/115X and AMD AM5/AM4 and other mainstream platforms; tool-free installation clip design, suitable for a variety of chassis types | Adapt to more than 95% of desktop computers on the market, easy to install, and novices can easily get started |
Durable and reliable quality | The heat pipe adopts vacuum welding technology to eliminate the risk of leakage; the surface of the fin is anodized (aluminum) or nickel-plated (copper), and the salt spray test exceeds 1000 No corrosion for hours | Provide 5-year warranty, adapt to complex usage environments, and reduce maintenance costs |
Materials and Technology
.Heat pipe: 99.99% high-purity oxygen-free copper is used, the inner wall adopts powder sintered liquid-absorbing core, and vacuum filling high-efficiency thermal conductive medium is used; precise bending at any angle is achieved through CNC pipe bending machine to ensure the best fit with CPU and fins.
.Fins: Aluminum fins are made of 6063 or 7075 aluminum alloy, formed by precision stamping, and anodized on the surface to enhance oxidation resistance; copper fins are made of T2 copper, which is made by CNC milling process and has excellent thermal conductivity.
.Welding process: Reflow soldering or vacuum brazing technology is used to achieve seamless connection between heat pipes and fins, ensuring heat conduction without loss.
Project | Specifications | Description |
Heat pipe specifications | 6mm×4 pieces / 8mm×6 pieces | Different models available to meet different cooling needs |
Fin material | Aluminum alloy / Copper alloy | Choose according to usage scenario |
Fin thickness | 0.2-0.3mm | Optimize cooling efficiency and wind resistance balance |
Fin size | 120×120×50mm (customizable) | Provide sufficient cooling area |
Fan size | 120mm×120mm×25mm | Standard specifications adapt to most chassis |
Air volume | 65-90CFM | Ensure efficient air circulation |
Noise level | 22-38dB(A) | Intelligent speed control to control noise range |
Compatible platforms | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Covering mainstream CPU interfaces |
Application scenarios
.Game consoles: Provide strong heat dissipation for high-end gaming CPUs, ensuring high frame rates and low latency throughout the game, bringing a smooth gaming experience.
.Professional workstations: In professional creation processes such as video editing, 3D modeling, and animation rendering, continuously suppress CPU high temperatures, accelerate computing processes, and improve work efficiency.
.Servers and data centers: Meet the heat dissipation requirements of servers running 24/7, ensure the stability and reliability of data centers, and reduce equipment failure rates.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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