The dual-fin heat pipe combined radiator is designed for high-power hardware, and adopts an innovative structure with multiple pure copper heat pipes running through two sets of dense aluminum fins. The heat pipe uses the principle of working fluid phase change to quickly transfer the heat generated by core components such as the CPU and GPU to the fins, and the dual fin group greatly expands the heat dissipation area. With a large air volume silent fan, it can form a strong air duct, achieve efficient heat exchange, effectively suppress the temperature during high-load operation, and provide stable and reliable heat dissipation protection for equipment such as game consoles and professional workstations.
Core advantages | Technical highlights | Application value |
Superior thermal conductivity | Equipped with 6-8 6mm/8mm pure copper heat pipes, inner wall powder sintering liquid absorption core; vacuum brazing process of heat pipe and fin, thermal resistance reduced by 60% | Instantly conducts heat from flagship CPUs and GPUs, reducing full-load temperature by 15-20℃ |
Double heat dissipation area | Dual fin array design, fin density reaches 45 pieces/cm, total heat dissipation area exceeds 25000cm² | Accelerates heat dissipation and supports long-term stable operation at high loads |
Intelligent silent control | Dual 12cm PWM smart fans, speed 500-2200RPM; FDB fluid bearing + 7-blade sickle fan blades, noise as low as 20dB (A) | Quiet for daily use, automatically enhances heat dissipation at high loads |
Full platform compatibility | Support Intel LGA1700/1200, AMD AM5/AM4 and other mainstream platforms; tool-free buckle design | Compatible with more than 98% of desktops, easy to install |
Long-lasting and durable quality | Heat pipe vacuum welding to prevent leakage, fin anodizing treatment, salt spray test 1500 hours without corrosion | Provides a 5-year warranty and adapts to complex usage environments |
Heat pipe: 99.99% oxygen-free copper heat pipe is selected, with a diameter of 6mm or 8mm, filled with high-efficiency thermal conductive medium, and combined with powder sintered liquid wick to improve heat transfer efficiency; precise bending through CNC bending technology to ensure close fit with heat source and fins.
Fins: 7075 aviation-grade aluminum alloy is used, which is formed by precision stamping, with a fin thickness of 0.25mm and precise spacing; the surface is anodized to form a dense oxide film to enhance anti-oxidation and anti-corrosion capabilities.
Welding process: Vacuum brazing technology is used to achieve seamless connection between heat pipes and fins, ensuring zero heat conduction loss and greatly improving overall heat dissipation efficiency.
Item | Specifications | Description |
Heat pipe specifications | 6mm×6 pieces / 8mm×8 pieces | Different configurations to meet differentiated needs |
Fin material | 7075 aluminum alloy | High strength, high thermal conductivity |
Fin thickness | 0.25mm | Optimized heat dissipation and wind resistance |
Fin density | 45 片 /cm | Double heat dissipation area |
Fan specifications | 120mm×120mm×25mm×2 | Dual fans with strong air ducts |
Air volume | 80-110CFM | Efficient air circulation |
Noise value | 20-40dB(A) | Intelligent speed control |
Compatible platforms | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Covering mainstream CPU interfaces |
Application scenarios
High-end gaming consoles: Cooling for flagship CPUs such as i9-14900K, Ryzen 9 9950X, and RTX 4090 graphics cards, ensuring high frame rates and high image quality throughout the game, and preventing frame drops.
Professional creative workstations: In high-load tasks such as 3D modeling, film and television rendering, and scientific computing, it continuously suppresses hardware high temperatures, accelerates task processing speed, and improves creative efficiency.
Data center servers: Meet the cooling needs of high-density server clusters, ensure 7×24 hours of uninterrupted and stable operation, and reduce equipment failure rates and operation and maintenance costs.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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