The composite heat spreader fin radiator combines the dual advantages of the heat spreader and fins, and is designed for high-heat devices. The heat spreader uses the vacuum cavity and the working fluid phase change principle to quickly and evenly diffuse heat, and is matched with densely arranged aluminum fins to greatly expand the heat dissipation area. Through the efficient connection between the heat pipe and the fins, the heat is quickly transferred to the air to achieve efficient heat exchange, providing excellent heat dissipation solutions for high-power hardware such as servers and high-end graphics cards, ensuring stable operation of the equipment.
Core advantages | Technical highlights | Application value |
Superior heat dissipation performance | The thickness of the heat spreader is only 3-5mm, and the heat conduction efficiency reaches 5000-10000W/(m・K); the fin density is 40-50 pieces/cm, and the total heat dissipation area exceeds 30000cm² | Effectively suppress the heat of AI servers, flagship graphics cards and other equipment, and reduce the full load temperature by 20-25℃ |
Efficient temperature balance design | The microstructure capillary network inside the heat spreader achieves 360° rapid heat conduction; the temperature difference is controlled within ±2℃ | Avoid local overheating and extend the service life of core components such as chips |
Intelligent silent operation | Equipped with dual 12cm PWM smart fans, the speed is 500-2200RPM; FDB fluid bearing + 7-blade sickle fan blades, the noise is as low as 20dB (A) | Quiet in daily use, automatically enhance heat dissipation under high load |
Full-scenario adaptation | Support Intel, AMD mainstream CPU platforms and multiple graphics cards; modular installation design | Adapt to different spaces such as server cabinets and desktop chassis, easy to install |
Long-lasting and durable quality | The heat spreader is made of oxygen-free copper, and the vacuum welding process is leak-proof; the fins are anodized and the salt spray test is 1500 hours without corrosion | Provide 5-year warranty and adapt to complex use environments |
III. Product Details
(I) Materials and Processes
Heat spreader: 99.99% oxygen-free copper is used, and the vacuum cavity is formed by stamping, and a microstructure capillary network is etched inside; it is sealed by vacuum welding technology and filled with high-purity working fluid to ensure efficient phase change heat transfer.
Fins: 7075 aviation-grade aluminum alloy is used, and the fin thickness is 0.25mm with precise spacing; the surface is anodized to form a dense oxide film to enhance the anti-oxidation and anti-corrosion capabilities.
Connection process: The heat spreader and the fins are connected by multiple 6mm/8mm pure copper heat pipes, and vacuum brazing technology is used to achieve seamless connection to ensure zero heat conduction loss.
(II) Technical parameters
Item | Specifications | Description |
Vapor chamber material | Oxygen-free copper | High thermal conductivity and sealing |
Vapor chamber size | 150×100×3mm (customizable) | Adapt to different heat source areas |
Fin material | 7075 aluminum alloy | High strength, high thermal conductivity |
Fin thickness | 0.25mm | Optimize heat dissipation and wind resistance |
Fin density | 40-50 pieces/cm | Provide ultra-large heat dissipation area |
Fan specification | 120mm×120mm×25mm×2 | Dual fan strong air duct |
Air volume | 80-110CFM | Efficient air circulation |
Noise level | 20-40dB(A) | Intelligent speed control |
Compatible platforms | Intel LGA1700/1200, AMD AM5/AM4 and other mainstream CPUs and RTX series, RX series graphics cards | Cover a wide range of hardware |
(III) Application scenarios
Data center servers: For high-load servers such as AI computing and big data processing, quickly suppress the heat of CPU and GPU clusters, ensure stable operation 24/7, and reduce energy consumption and operation and maintenance costs.
High-end game consoles: Cool flagship graphics cards and multi-core CPUs, avoid performance reduction due to overheating in high frame rate operations such as 4K games and VR scenes, and improve the gaming experience.
Professional workstations: Meet the strict requirements of professional software such as 3D modeling and film and television rendering on hardware performance, ensure continuous and stable output of equipment through efficient heat dissipation, and improve creative efficiency.
Cloud computing equipment: Adapt to the high-density deployment requirements of cloud computing centers, the temperature uniformity characteristics of the heat spreader effectively solve the problem of concentrated heating of multiple chips and ensure the reliability of equipment operation.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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