CPU radiator (heat pipe air cooling radiator) is the core equipment in the field of computer hardware cooling, specially designed to solve the heating problem of CPU when running under high load. Its core structure consists of high thermal conductivity heat pipe, dense heat dissipation fins and large-size cooling fan. The heat pipe is made of pure copper material, and uses the gas-liquid phase change principle of the internal working fluid to quickly transfer the heat from the CPU surface to the fins; the aluminum heat dissipation fins are made by precision stamping process, with wavy or serrated structure to greatly increase the heat dissipation area; the matching silent fan uses scientific air duct design to force air convection and accelerate heat dissipation.
Core advantages | Technical highlights | Application value |
Superior heat dissipation performance | Equipped with 4-6 pure copper heat pipes with a diameter of 6mm or 8mm, the heat conduction efficiency is increased by 50%; the fin density reaches 30-40 pieces/cm, and the heat dissipation area exceeds 15000cm² | Easily suppress the heat of high-end CPUs such as i9 and Ryzen 9 when fully loaded, ensuring the continuous release of hardware performance |
Intelligent silent design | Equipped with PWM intelligent speed control fan, the speed range is 600-2000RPM, and it supports motherboard temperature control; the fan adopts hydraulic bearings and 7 sickle-shaped blades, and the operating noise is as low as 22dB (A) | Quiet operation during daily office work, automatic speed-up during games/rendering, taking into account quiet environment and efficient heat dissipation |
Efficient air duct optimization | The fins adopt a wavy or serrated design, and the forward-swept fan blades of the fan form a directional airflow channel, reducing wind resistance by 30% | Enhance air circulation efficiency, reduce heat accumulation, and improve overall heat dissipation effect |
Wide compatibility | Supports mainstream platforms such as Intel LGA1700/1200/115X and AMD AM5/AM4; the buckle design is tool-free installation, and it is suitable for a variety of chassis types | Adapt to more than 95% of desktop motherboards on the market, easy to install, user-friendly |
Durable and reliable quality | The heat pipe adopts vacuum welding technology to eliminate the risk of leakage; the surface of the fin is treated with anti-oxidation, and the fan service life exceeds 50,000 hours | Provide up to 5 years of warranty to ensure long-term stable operation and reduce maintenance costs |
III. Product Details
(I) Material and Technology
. Heat pipe: Made of high-purity oxygen-free copper, the inner wall adopts powder sintered liquid wick, and vacuum-filled high-efficiency heat-conducting medium to ensure rapid heat conduction.
. Fins: Made of 0.3mm thick 6063 aluminum alloy, processed by stamping and anodizing to enhance heat dissipation and anti-oxidation capabilities.
. Fan: The fan blades are made of PC material, with high toughness and low wind resistance; the hydraulic bearing design reduces friction and extends service life; supports PWM intelligent speed regulation technology to achieve precise temperature control.
(II) Technical Parameters
Item | Specifications | Description |
Heat pipe specifications | 6mm×4pcs / 8mm×6pcs | Different models available to meet different cooling needs |
Fin size | 120×120×50mm | Provide sufficient cooling area |
Fan size | 120mm×120mm×25mm | Standard specifications, suitable for most chassis |
Air volume | 65-90CFM | Ensure efficient air circulation |
Noise level | 22-38dB(A) | Intelligent speed control to control noise range |
Compatibility | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Covering mainstream CPU platforms |
(III) Application scenarios
.Game consoles: To cope with high-load scenarios such as 3A masterpieces and e-sports games, ensure stable CPU performance throughout the process, and avoid game freezes and frame drops due to overheating.
.Content creation workstations: In professional creation processes such as video editing, 3D modeling, and animation rendering, continuously suppress CPU high temperatures to ensure smooth software operation and improve creation efficiency.
.Servers and data centers: Meet 24-hour uninterrupted operation requirements, and rely on stable heat dissipation performance to ensure the reliability and stability of servers working under long-term high-load conditions.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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