The black anodized aluminum/copper column radiator is a high-performance heat dissipation device specially developed for high-heat electronic equipment, industrial equipment and heating systems. 6063/7075 aluminum alloy or T2 copper is selected as the base material. Through precision extrusion or CNC processing technology, the metal is transformed into a regularly arranged columnar structure, which significantly expands the heat dissipation surface area. Aluminum has the characteristics of light weight and balanced thermal conductivity, while copper has a higher thermal conductivity. Both can quickly absorb heat from heat sources such as CPU, power modules, and heating pipes, and efficiently conduct it to the air.
Core advantages | Technical highlights | Application value |
Superior heat dissipation performance | The thermal conductivity of the aluminum model is 180 - 230W/(m・K), and the copper model is up to 400W/(m・K); the columnar array design increases the heat dissipation area by 200% compared to the traditional flat type | Quickly suppress the temperature of high-heating components such as server CPU and high-frequency power supply to ensure stable operation of data center 7×24 hours |
Durable and corrosion-resistant | The anodized film of the aluminum model is 25μm thick, and the nano-coating of the copper model has strong adhesion and is corrosion-free after more than 1500 hours of salt spray test | Adapt to harsh environments such as coastal high humidity and industrial dust, reduce maintenance costs, and have a service life of more than 10 years |
Lightweight and high strength | The density of the aluminum model is only 2.7g/cm³, which is 60% lighter than the steel radiator; the copper model is strengthened by a special process and has a tensile strength of more than 250MPa | Easy to install in high altitude and small space, while ensuring the stability of the structure and avoiding deformation |
Flexible customization | Supports personalized customization of the number, height, and spacing of columns; can integrate auxiliary components such as fans and air guides; provides a variety of interfaces to adapt to different heat sources | Meet the diverse heat dissipation needs of server rooms, industrial equipment, smart homes, etc. |
Quiet and low-power operation | Pure passive heat dissipation design (no fan) noise 0dB; with intelligent speed control fan, energy saving and noise reduction | Applicable to silent scenes such as libraries and hospitals, as well as green buildings that are sensitive to energy consumption |
III. Product Details
(I) Material and Process
. Material Selection:
Aluminum: 6063 aluminum alloy is used, which is suitable for heat dissipation of conventional electronic equipment; 7075 aviation-grade aluminum alloy meets high-end servers, industrial control and other high heat dissipation demand scenarios.
Copper: T2 copper is selected, with a purity of up to 99.9%. With its ultra-high thermal conductivity, it is specially designed for high-heating components such as graphics cards and CPUs.
. Processing Technology: Through precision extrusion molding technology, the column size accuracy (tolerance ±0.1mm) is ensured; the surface treatment adopts anodizing (aluminum) or black nano-coating spraying (copper) to enhance the protection performance and aesthetics; some models are finely processed by CNC to achieve a close fit between the radiator and the heating element.
(II) Technical Parameters
Project | Aluminum index | Copper indicators | Description |
Material | 6063/7075 aluminum alloy | T2 Copper | Select according to the usage scenario |
Thermal conductivity | 180 - 230W/(m·K) | 400W/(m·K) | Comparison of heat transfer efficiency |
Column size | Diameter 8 - 15mm, height 50 - 200mm | Diameter 8 - 15mm, height 50 - 200mm | Customizable |
Heat dissipation area | 2 - 8㎡ | 2 - 8㎡ | Adapt to different heat load requirements |
Operating temperature | -40℃ - 180℃ | -40℃ - 250℃ | Adapt to extreme environmental conditions |
Installation method | Wall-mounted, floor-standing, embedded | Wall-mounted, floor-standing, embedded | Flexibly adapt to various scenarios |
(III) Application scenarios
.Data center: Installed next to server cabinets and power distribution units (PDUs), it can quickly dissipate heat from high-density electronic components, reduce the energy consumption of air conditioners in computer rooms, and ensure safe and stable data transmission.
.Industrial automation: Dissipate heat for inverters, PLC control cabinets, industrial power supplies and other equipment, resist oil and dust erosion, and ensure continuous and stable operation of industrial production lines.
.New energy field: Suitable for heat dissipation of charging piles and energy storage battery cabinets. Lightweight (aluminum) or high thermal conductivity (copper) design meets the stringent requirements of outdoor equipment and extends service life.
.Smart home heating: Used as a new type of radiator, it heats up quickly and has a simple shape. It is suitable for floor heating, central heating and other systems to improve home comfort and aesthetics.
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China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
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