Aluminum CPU heat sink is a key component of computer hardware heat dissipation, specially designed to solve the heating problem of CPU under high load operation. It is made of 6063 or 7075 aluminum alloy as the main material. With the characteristics of light weight and good thermal conductivity of aluminum alloy, combined with precision stamping, forging or CNC processing technology, aluminum is transformed into a delicate heat dissipation fin and base. The wavy and serrated fin design greatly extends the heat dissipation area; the base is finely polished and fits tightly with the CPU to achieve rapid absorption and conduction of heat.
Core advantages | Technical highlights | Application value |
Efficient heat dissipation | Using high-purity aluminum alloy, the thermal conductivity reaches 180 - 230W/(m・K); the fin density is 35 - 45 pieces/cm, and the heat dissipation area exceeds 12000cm² | Easily cope with the cooling needs of mid-to-high-end CPUs such as i7 and Ryzen 7, ensuring stable output of hardware performance |
Lightweight design | The density of aluminum alloy is only 2.7g/cm³, which is more than 50% lighter than the copper radiator | Adapt to various chassis, especially suitable for ITX small chassis and notebook cooling module upgrades, reducing the burden on the motherboard |
Quiet operation | Equipped with hydraulic or FDB bearing fans, supports PWM intelligent speed regulation, speed 600 - 1800RPM, and noise as low as 20dB (A) | Quiet in daily use, automatically speed up under high load, balance quietness and cooling effect |
Durable and reliable | Surface anodizing treatment, salt spray test for more than 1000 hours without corrosion; fan life exceeds 40000 hours | Adapt to complex environments, reduce maintenance costs, and provide a 3-year warranty |
Wide compatibility | Supports mainstream platforms such as Intel LGA1700/1200/115X and AMD AM5/AM4, tool-free installation of clips | Adapt to more than 90% of desktops, easy to install |
Material and craftsmanship
.Material: The basic model uses 6063 aluminum alloy, which has good thermal conductivity and processability, and is suitable for daily office and entertainment scenes; the high-end model uses 7075 aviation-grade aluminum alloy, which has better strength and thermal conductivity to meet the heat dissipation needs of high-performance CPUs.
.Craftsmanship: Through precision stamping, the fin size is accurate and the spacing is uniform; some products use CNC machining to create an integrated base to improve the fit with the CPU; anodizing treatment not only enhances wear resistance and oxidation resistance, but also provides a variety of color options to meet personalized needs.
Item | Specifications | Description |
Material | 6063/7075 aluminum alloy | Different models are available on demand |
Fin thickness | 0.2 - 0.3mm | Optimize heat dissipation and wind resistance |
Fin size | 100×100×45mm (customizable) | Provide sufficient heat dissipation area |
Fan size | 120mm×120mm×25mm | Adapt to most chassis |
Air volume | 55 - 80CFM | Ensure air circulation |
Noise level | 20 - 35dB(A) | Intelligent speed control and noise control |
Compatible platforms | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Cover mainstream CPU interfaces |
Application scenarios
. Home office: Meet low-load scenarios such as daily office, audio-visual entertainment, etc., run quietly, and do not affect the user experience.
. Game console: Effectively suppress the heat of i5, Ryzen 5 and other gaming CPUs to ensure smooth gaming and avoid lag.
. Small workstation: Lightweight design adapts to ITX chassis, providing reliable heat dissipation support for video editing and light 3D modeling.
. Laptop upgrade: Suitable for laptop cooling module replacement, improving stability and service life during high-load operation.
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