Active fin + fan combination radiator is an efficient heat dissipation device designed to solve the high heat generation problem of electronic equipment. Its core is composed of high-density heat dissipation fins and high-performance heat dissipation fans. The fins are made of aluminum alloy or copper alloy and are made by precision stamping or milling. The wavy and zigzag shapes greatly increase the heat dissipation area and quickly absorb the heat generated by electronic components such as CPU, GPU, and power module.
Core advantages | Technical highlights | Application value |
Strong heat dissipation performance | The fin density is 35-45 pieces/cm, and the heat dissipation area exceeds 12000cm²; the fan air volume can reach up to 90CFM, and the air pressure reaches 3.5mmH₂O | Easily suppress the high heat of high-end CPUs such as i9 and Ryzen 9 and flagship graphics cards, ensuring full frame operation of game consoles and stable operation of servers 7×24 hours |
Intelligent and silent operation | Equipped with PWM intelligent speed control fan, the speed range is 600-2000RPM, and it supports motherboard temperature control; it adopts hydraulic bearing and 7-blade sickle-shaped fan blade design, and the operating noise is as low as 22dB (A) | Quiet during daily office work, automatically speed up under high load, taking into account both silent effect and efficient heat dissipation |
Efficient air duct design | The fin adopts a wavy or serrated structure, and the fan forward-swept fan blade forms a directional airflow channel, reducing wind resistance by 30% | Enhance air circulation efficiency, reduce heat accumulation, and improve overall heat dissipation effect |
Wide compatibility | Supports mainstream platforms such as Intel LGA1700/1200/115X and AMD AM5/AM4; it is compatible with a variety of chassis types, and the installation clips are tool-free for removal | Adapt to more than 95% of desktop computers on the market, and also suitable for industrial computers, servers and other equipment |
Durable and reliable quality | The surface of the fin is anodized or nickel-plated, and has strong anti-oxidation ability; the fan service life exceeds 50,000 hours, and provides a 3-year long warranty | Adapt to complex use environments, reduce maintenance costs, and ensure long-term stable operation |
Product Details
(I) Material and Process
.Material Selection:
Fin: 6063 aluminum alloy is used, which has good thermal conductivity and processing performance, suitable for conventional heat dissipation scenarios; high-end models are made of copper alloy, which has excellent thermal conductivity and is designed for high-heat components.
Fan: The fan blades are made of PC material, which has high toughness and low wind resistance; the bearings are hydraulic bearings or FDB bearings to reduce friction and extend service life.
.Processing Technology: The fins are formed by precision stamping or CNC milling to ensure accurate size and uniform spacing; the fan uses balanced calibration technology to reduce operating jitter; the radiator as a whole uses reflow soldering or vacuum brazing technology to achieve seamless connection between the fins and the base to reduce thermal resistance.
(II) Technical Parameters
Item | Specifications | Description |
Fin material | Aluminum alloy / Copper alloy | Select according to different models |
Fin thickness | 0.2 - 0.3mm | Optimize heat dissipation efficiency and wind resistance balance |
Fin size | 120×120×50mm (customizable) | Provide sufficient heat dissipation area |
Fan size | 120mm×120mm×25mm | Standard specifications adapt to most chassis |
Air volume | 55 - 90CFM | Ensure efficient air circulation |
Air pressure | 1.5 - 3.5mmH₂O | Meet different heat dissipation requirements |
Noise level | 22 - 38dB(A) | Intelligent speed control noise range |
Compatible platforms | Intel LGA1700/1200/115X, AMD AM5/AM4, etc. | Covering mainstream CPU interfaces |
Application scenarios
.Game consoles: effectively suppress the heat of high-end CPUs and graphics cards, ensure stable hardware performance output during gaming, and avoid game freezes and frame drops due to overheating.
.Professional workstations: in professional creation processes such as video editing, 3D modeling, and animation rendering, continuously dissipate heat for high-load hardware, accelerate the computing process, and improve creative efficiency.
.Industrial control equipment: suitable for industrial computers, automation control cabinets and other equipment, in harsh industrial environments such as high temperature and dust, provide reliable heat dissipation support for electronic components, and ensure continuous and stable operation of industrial production.
.Data center servers: dissipate heat for high-density servers, quickly dissipate a large amount of heat, reduce the overall energy consumption of the computer room, and improve the operating efficiency and stability of the data center.
Headquarters tel.
E-mail.
China management center add.204, Building A, Phase 3, Jiewei Industrial Park, Shangmugu Community, Pinghu Street, Longgang District, Shenzhen, China
Headquarters tel.+86 134 3077 5139
E-mail.
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