As a precision electronic component, this electronic aluminum alloy heat sink bracket is specially designed for the heat dissipation needs of electronic equipment. Made of aviation-grade aluminum alloy, it undergoes CNC precision machining and anodizing treatment to present a simple and neat frame structure with integrated heat dissipation fins and mounting adapters. It is suitable for electronic components such as power modules and chipsets, and is widely used in industrial control equipment, communication base stations, consumer electronics and other fields. Through the efficient thermal conductivity of aluminum materials and the expansion of the heat dissipation area of fins, it accelerates the heat dissipation of electronic components and ensures the stable operation of equipment under high load conditions. It is a key component for temperature control and structural support of electronic systems.
(I) Performance Parameters
Parameters | index |
Material | Aircraft grade aluminum alloy (6061 - T6) |
Dimensional tolerance | ±0.05mm |
Thermal conductivity | 200W/(m·K) |
Load bearing capacity | ≤8kg(Static ) |
Operating temperature | -40℃ - 200℃ |
(II) Core features
1. Efficient heat dissipation: The aluminum alloy substrate has fast heat conduction, and the fin structure increases the heat dissipation area. Combined with the internal airflow of the equipment, the temperature of electronic components can be reduced by 15-25℃, suppressing the risk of overheating and frequency reduction.
2. Precision adaptation: CNC processing ensures accurate dimensions, and the installation holes, buckles and electronic components fit seamlessly. There is no looseness after installation, ensuring the stability of the equipment structure.
3. Durable and reliable: The anodized surface hardness reaches HV300, which is wear-resistant and corrosion-resistant. It has no damage after 480h of salt spray test, and is suitable for complex industrial environments and long-term use of consumer electronics.
III. Product details
This electronic aluminum alloy heat dissipation bracket integrates material science and precision manufacturing technology. Selected 6061-T6 aluminum alloy is smelted and extruded into blanks, and then milled, drilled and milled fins by a five-axis CNC machining center to ensure dimensional accuracy and structural consistency. The surface is anodized to form a 10-15μm dense oxide film, which is both protective and beautiful.
In electronic equipment applications, it can accurately fit the power chip and quickly export heat; when used in communication modules, it accelerates the heat circulation in the cabinet to ensure signal stability. The entire production process is inspected, and the dimensions are controlled by a three-coordinate measuring instrument, and the heat dissipation efficiency is verified by a thermal imager. From the stable temperature control of industrial control motherboards to the chip heat dissipation of high-end mobile phones, this bracket has a precise design, efficient heat conduction, and durability to build a "cooling defense line" for electronic equipment, helping smart terminals, industrial equipment and other products to improve performance limits and service life.