Micro Deep Drawn Stamping parts

　　Micro Deep Drawn Stamping Parts

　　What is Micro Deep Drawn Stamping?

　　Micro Deep Drawn Stamping is a precision forming process specifically designed for miniaturized, high-precision thin-walled components. Based on traditional deep drawing technology, it gradually draws ultra-thin metal blanks in micro-molds through precise control of mold movement and material flow, forming cup-shaped, tubular, box-shaped, or special-shaped microstructures with a large depth-to-diameter ratio (depth/diameter). Its core characteristics are miniature size (feature size usually 0.1mm-10mm), uniform wall thickness (tolerance up to ±0.001mm), high forming precision, and the ability to achieve integrated forming of complex micro-features.

　　Compared with conventional deep drawn stamping, micro deep drawing must overcome technical challenges brought by miniaturization, such as material flow control, mold precision matching, and uniformity of forming force. It is a key process connecting precision metal forming and micro-manufacturing.

　　How It Works

　　The core of micro deep drawn stamping lies in achieving uniform plastic deformation of micro-metal blanks under mold constraints through multi-pass precise drawing. The specific process and key control points are as follows:

　　Blank Preparation: High-precision thin materials (such as precision cold-rolled steel, ultra-thin copper strips) with a thickness of 0.01mm-0.5mm are used. The blank size needs to be optimized through simulation calculations to ensure sufficient material supply and no excess waste during the drawing process.

　　Positioning and Blank Holding: The blank is fixed by a micron-level positioning mechanism, and the blank holder applies uniform and adjustable blank holding force. This not only prevents wrinkling of the material during drawing but also ensures smooth material flow into the die cavity.

　　Drawing Forming: The precision punch descends at a constant speed to gradually draw the blank into the micro-die. Depending on the part's depth-to-diameter ratio (usually ≥2:1), it can be divided into single-pass or multi-pass drawing. For excessively large depth-to-diameter ratios, multiple drawing passes are required to gradually increase the depth. After each drawing, annealing treatment is necessary to restore material ductility and avoid cracking.

　　Trimming and Demolding: After the final drawing pass, a trimming mold is used to correct dimensional deviations. The part is then removed by micro-ejector pins or a vacuum adsorption device, avoiding contact damage to the micro-structures throughout the process.

　　The entire process requires controlling the mold clearance (usually 1.05-1.1 times the material thickness), drawing speed (0.5-5mm/s), and temperature to ensure uniform material deformation and prevent defects such as uneven wall thickness, cracking, and springback.

　　Key Components

　　Micro Punch and Die: Made of cemented carbide (WC-Co) or polycrystalline diamond (PCD), with a dimensional accuracy of ±0.001mm and a surface roughness of Ra≤0.02μm, ensuring the formed parts have a smooth surface without scratches.

　　Precision Blank Holder: Equipped with a micron-level pressure adjustment mechanism, which can real-time adjust the blank holding force according to material characteristics to prevent wrinkling or tearing of the micro-blank.

　　Positioning and Guiding Mechanism: Adopts ball guide pillars and bushes or air-floating guiding to ensure the coaxiality error between the punch and die is ≤0.002mm, avoiding part deformation caused by eccentric load.

　　Micro Ejection Device: Includes ejector pins (minimum diameter 0.1mm) or a vacuum adsorption system to ensure damage-free removal of micro-parts and prevent mold jamming.

　　Temperature Control System: For parts with a high depth-to-diameter ratio, local heating or cooling modules are equipped to optimize material plastic flow and reduce forming difficulty.

　　Advantages vs Traditional Deep Drawn Stamping

　　Micro deep drawn stamping shows significant advantages in miniaturization scenarios: In terms of dimensional control, it can form micro-features of 0.1mm-10mm with a tolerance accuracy of ±0.001-0.01mm, while the minimum feature size of traditional deep drawing is usually ≥10mm with a tolerance of only ±0.05mm or more. Regarding wall thickness uniformity, the wall thickness deviation of micro deep drawn parts is ≤5%, compared with 15%-20% for traditional deep drawn parts. It has a stronger depth-to-diameter ratio capability—micro deep drawing can achieve micro-structures with a depth-to-diameter ratio of 3:1-5:1, while traditional deep drawing can only achieve a depth-to-diameter ratio of ≤2:1 for micro-sized parts. In terms of surface quality, micro deep drawn parts have a surface roughness of Ra≤0.1μm and do not require secondary polishing, whereas traditional deep drawn parts are prone to scratches and ripples on the surface and need subsequent treatment. For material utilization, micro deep drawing reduces waste through precise blank design, with a scrap rate of ≤5%, which is much lower than the 15%-30% of traditional deep drawing. It also has outstanding integrated forming capabilities, directly forming complex micro-features such as micro-grooves, bosses, and threads, reducing assembly processes—while traditional micro-parts made by deep drawing often require split processing and subsequent assembly.

　　Applications

　　Electronics & Semiconductors

　　Micro connectors: Precision terminals, micro-connector housings

　　Sensor components: Pressure sensor diaphragms, micro-sensor housings

　　Electronic components: Micro-capacitor housings, micro-battery steel cases (button batteries, micro-lithium batteries)

　　Medical Devices

　　Implantable devices: Micro-pacemaker housings, implantable sensor sleeves

　　Minimally invasive instruments: Micro-catheters, endoscope biopsy channel components

　　Diagnostic equipment: Micro-reagent tubes, metal bases for test chips

　　Aerospace

　　Precision instruments: Micro-gyroscope components, accelerometer housings

　　Avionics: Micro-relay parts, micro-connectors for satellites

　　Consumer Electronics

　　Portable devices: Bluetooth headphone sound unit housings, micro-camera decorative rings

　　Smart wearables: Smartwatch sensor protective cases, micro-antenna components

　　Materials Used

　　Non-ferrous metals (dominant materials with excellent ductility):

　　Copper and alloys: Pure copper (T2), brass (H62), phosphor bronze (QSn6.5-0.1) (conductive/thermal conductive/corrosion-resistant)

　　Aluminum alloys: 1050, 3003 (lightweight, easy to form)

　　Nickel and alloys: Pure nickel (N6), Inconel alloys (high/low temperature resistance, corrosion resistance)

　　Stainless steel: 304, 316L (corrosion-resistant, good biocompatibility, suitable for medical/aerospace fields)

　　Special materials: Titanium alloy (TA1) (specialized for medical implants with excellent biocompatibility), tantalum alloy (high-end aerospace/medical devices)

　　Thickness range: 0.01mm-0.5mm, preferably precision thin strips with uniform grain size and low impurity content

　　When to Use Micro Deep Drawn Stamping?

　　When producing miniaturized (feature size ≤10mm) and thin-walled (wall thickness ≤0.5mm) components

　　When strict requirements are placed on dimensional accuracy, wall thickness uniformity, and surface finish without the need for secondary processing

　　When the part has a depth-to-diameter ratio ≥2:1, which is difficult or costly to achieve with traditional micro-processing (such as mechanical turning)

　　When integrated forming of complex micro-features (such as micro-grooves, bosses, threads) is required to reduce assembly processes

　　When special requirements are imposed on material biocompatibility, corrosion resistance, and stability in fields such as medical and aerospace

　　Limitations

　　Mold requires micron-level precision and wear resistance, resulting in high initial mold development cost and long lead time

　　The forming process has strict requirements on equipment precision (such as press positioning accuracy, speed control), leading to high equipment investment threshold

　　Materials need to have good ductility and uniformity, so the range of applicable materials is relatively limited

　　Parts with a high depth-to-diameter ratio require multi-pass drawing + intermediate annealing, resulting in lower production efficiency than ordinary stamping

　　Micro-part removal and inspection are difficult, requiring supporting specialized automation equipment and testing instruments

　　Summary

　　Micro deep drawn stamping is a high-end forming process for micro-precision manufacturing. Through precise control of material flow and mold movement, it achieves integrated high-precision forming of miniature, thin-walled, and high depth-to-diameter ratio components. Its core advantage lies in the perfect balance of miniaturization capability, dimensional accuracy, and surface quality, making it particularly suitable for the strict requirements of high-end fields such as electronics, medical, and aerospace for micro-components. Although the initial investment (mold/equipment) is relatively high, its characteristics such as high material utilization, elimination of secondary processing, and integrated forming can significantly reduce the comprehensive cost of mass production, making it a core manufacturing solution for micro-precision metal components.

Read recommendations:

Sealing ring Precision electronic parts

Housing components for recessed downlights Precision electronic parts

Oval Magnetic Hardware Precision electronic parts

CNC Machining Dimension Accuracy

CNC processing factory - Meeting customers' strict requirements for precision